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About this event

The Wafer-Level Packaging Symposium is an informative and dynamic event that brings together industry leaders, engineers, and professionals from the semiconductor and electronics packaging community. Attendees can expect to gain insight into the latest advancements, trends, and technologies in wafer-level packaging through interactive sessions, panel discussions, and networking opportunities.

Map & Directions

Map & Directions

Innovation Summit San Francisco, Burlingame, CA 94010 United States of America,, Burlingame, California, United States, 94010
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